Low temperature transport of Al into and through copper starting with Cu/Al/SiO2 bilayers

Journal of Applied Physics

Volumn 85, Issue 3, 1999, Pages 1487-1495

  Lanford, W A ^a   Bedell, S ^a   Isberg, P ^b   Hjorvarsson, B ^b   Lakshmanan, S K ^c   Gill, W N ^c  

^a STATE UNIVERSITY OF NEW YORK   (United States)

^b UPPSALA UNIVERSITY   (Sweden)

^c RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0008833052     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.369336     Document Type: Article

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