Carbon-doped copper as a high-conductivity liner for copper/Benzocyclobutene (BCB) interconnects

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 167-169

  Neirynck, J M ^a   Xiao, Y ^a   Gutmann, R J ^a   Murarka, S P ^a  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; INTEGRATED CIRCUIT INTERCONNECTS; OXIDE SEMICONDUCTORS;

DAMASCENE INTERCONNECTS; ELECTRICAL CHARACTERIZATION; ETCH MASK; HIGH CONDUCTIVITY; INTERCONNECT STRUCTURES; METAL POLYMERS; SINGLE LEVEL;

COPPER COMPOUNDS;

EID: 0008812803     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787111     Document Type: Conference Paper

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