Improving the deposit distribution during electroforming of complicated shapes

Bulletin of Electrochemistry

Volumn 15, Issue 5-6, 1999, Pages 202-204

  John, S ^a   Ananth, V ^a   Vasudevan, T ^b  

^a CENTRAL ELECTROCHEMICAL RESEARCH INSTITUTE   (India)

^b ALAGAPPA UNIVERSITY   (India)

Author keywords

Current distribution; Electroforming; Hull Cell

Indexed keywords

EID: 0008446826     PISSN: 02561654     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. R O Hull, U S Patent 2149344 (1935)
2. R O Hull, Proc Amer Electroplat Soc, 5 (1939) 52
3. J B Mholer, Met Finish 57, 4 (1959) 55
4. J K Skwirnynski and M Huttley, J Electrochem Soc, 43 (1956) 239
5. R Gilmont and R F Walton, Proc Amer Electroplat Soc, 43 (1956) 239
6. R Gilmont and R F Walton, J Electrochem Soc, 103 (1956) 249
7. R A Dimon, Proc Amer Electroplat Soc, 35 (1948) 169
8. R Teraikado and J Nagasaka, Metal Finish, 71-1 (1979) 17
9. D R Gabe and G Wilcox, Trans Inst Metal Finish, 71-2 (1993) 71
10. Po Yen Lu, Plat Surf Finish, 78/0 (1991) 62