Size effects on the thermal conductivity of thin metallic wires: microscale implications

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 357, Issue 3, 1998, Pages 214-220

  Stewart, Derek ^a   Norris, Pamela M ^a  

^a University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRON TRANSPORT PROPERTIES; MICROELECTROMECHANICAL DEVICES; PROBABILITY DENSITY FUNCTION; THERMAL GRADIENTS; ULSI CIRCUITS; WIRE;

BOLTZMANN TRANSPORT EQUATION; RADIAL SIZE EFFECTS; THIN METALLIC WIRE;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 0007044013     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. Dingle, R. B., 1949, "The Electrical Conductivity of Thin Wires," Proc. Roy. Soc. (London), Vol. A201, pp. 545-560.
2. Fuchs, K., 1938, "The Conductivity of Thin Metallic Films According to the Electron Theory of Metals," Proc. Cambridge Phil. Soc., Vol. 34, pp. 100-108.
3. Kittel, C., 1986, Introduction to Solid State Physics, 6th Edition, John Wiley, New York.
4. Kumar, S., Vradis, G. C., 1994, "Thermal Conductivity of Thin Metallic Films," ASME Journal of Heat Transfer, Vol. 116, pp. 28-34.
5. Majumdar, A., 1993, "Microscale Heat Conduction in Thin Dielectric Films," ASME Journal of Heat Transfer, Vol. 115, pp. 7-16.
6. Rabaey, J. M., 1996, Digital Integrated Circuits, Prentice Hall, New Jersey.
7. Scherge, M., 1994, "Electromigration - Simulation and Experiment," Proc. 2nd Stress-Induced Phenomena in Metallization, AIP Conference Proceedings 305, pp. 290-299.
8. Tellier, C. R. and Tosser, A. J., 1982, Size Effects in Thin Films, Elsevier Publishing, New York.
9. Tien, C. L., Armaly, B. F., and Jagannathan, P. S., 1969, "Thermal Conductivity of Thin Metallic Films and Wires at Cryogenic Temperatures," Thermal Conductivity VIII, Plenum Press, pp. 13-19.
10. Wilson, A. H., 1953, The Theory of Metals, 2nd Edition, Cambridge University Press, New York.