Fixed abrasive grinding of CVD SiC mirrors

Precision Engineering

Volumn 16, Issue 2, 1994, Pages 109-116

  Bifano, Thomas ^a   Yi, Yuan ^a   Kahl, Keith ^b  

^a BOSTON UNIVERSITY   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

ceramic machining; ductile regime grinding; optical fabrication; ultraprecision grinding

Indexed keywords

EID: 0006620587     PISSN: 01416359     EISSN: None     Source Type: Journal    
DOI: 10.1016/0141-6359(94)90195-3     Document Type: Article

References (23)

1. SiC—an emerging material
2. Chemically vapor deposited silicon carbide (SiC) for optical applications
3. Some speculations on the mechanics of abrasive grinding and polishing
4. Ductile-regime grinding: a new technology for machining brittle materials
5. Microgrinding of brittle materials
6. Chemomechanical effects in ductile-regime grinding
7. Brittle to shear grinding mode transition for loose abrasive grinding
8. Ultraprecision grinding technology for brittle materials: application to surface and centerless grinding processes
9. Advanced fabrication of optical materials
10. Specific grinding energy as an in-process control variable for ductile-regime grinding
11. Ductile-regime machining model for diamond turning of brittle materials
12. Ductile grinding of glass
13. Ductile-regime grinding of ceramic mirrors
14. Ultra-precision grinding of thin quartz wafers
15. Shear mode grinding to remove residual damage from brittle mode grinding
16. An overview of ion beam milling
17. Electrical assisted grinding of precision glass and ceramic parts
18. Electrochemical dressing of bronze bonded grinding wheels
19. Mirror Surface Grinding of Silicon Wafers with Electrolytic In-process Dressing
20. Development of a model for precision contour grinding of brittle materials