Reactively sputtered ternary films of the type TM-Si-N and their properties (TM = early transition metal)

Vacuum

Volumn 59, Issue 2-3, 2000, Pages 716-720

  Nicolet, Marc A ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0006377816     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0042-207x(00)00338-9     Document Type: Article

References (25)

1. Posadowski W. Thin Solid Films 1988;162:111-7.
2. Asai K, Sugahara H, Matsuoka Y, Tokumitsu M. J Vac Sci Technol 1988;B6:1526-9.
3. Dauksher WJ, Resnick DJ, Cummings KD, Baker J, Gregory RB, Theodore ND, Chan JA, Johnson WA, Mogab CJ, Nicolet M-A, Reid JS. J Vac Sci Technol B 1995;13(6):3103-6.
4. Linder C, Dommann A, Staufert G, Nicolet M-A. Sensors and Actuators A 1997;61:387-91.
5. Li S, Shi Y, Peng H. Plasma Chem Plasma Process 1992;12(3):287-97.
6. Veprek S. Thin Solid Films 1998; 317: 449-54 and references therein.
7. Raajimakers IJ. Thin Solid Films 1994;247(1):85-93.
8. Smith PM, Custer JS, Jones RV, Maverick AW, Roberts DA, Norman JAT, Hochberg AK, Bai G, Reid JS, Nicolet M-A. In: Ellwanger RC, Wang S-Q, Editors. Advanced metallization and interconnect systems for ULSI applications in 1995. Pittsburgh, PA: Mat Res Soc, 1996: p. 249-56.
9. Sun X, Reid JS, Kolawa E, Nicolet M-A. J Appl Phys 1997;81(2):656-63.
10. Sun X, Kolawa E, Im S, Garland C, Nicolet M-A. Appl Phys A 1997;65:43-5.
11. Veprek S, Reiprich S. Thin Solid Films, 1995;268:64-71.
12. Diserens M, Patscheider J, Lévy F. Surf Coat Technol 1998;109(1-3):241-6.
13. Gottlieb U, Sun X, Kolawa E, Nicolet M-A. Mat Res Soc Symp Proc 1996;427:361-4.
14. Hirvonen J-P, Suni I, Kattelus H, Lappalainen R, Torry P, Kung H, Jervis TR, Nastasi M, Tesmer JR. Surf Coat Technol 1995;74-75:981-5.
15. Reid JS. thesis, California Institute of Technology, May 1995.
16. Reid JS, Kolawa E, Ruiz RP, Nicolet M-A. Thin Solid Films 1993;236:319-24.
17. Kwok C-K, Reid JS, Kolawa E, Ruiz RP, Nicolet M-A. Thin Solid Films 1993;236:319-24.
18. Linder C, Dommann A, Staufert G, Nicolet M-A. Sensors and Actuators A 1997;61:387-91.
19. Loura C, Cavaleiro A. Thin Solid Films 1998;336:1-6.
20. Kacsich T, Gasser S, Tsuji Y, Dommann A, Nicolet M-A. J Appl Phys 1999;85(3):1871-5.
21. de Reus R, Christensen C, Weichel S, Bouwstra S, Janting J, Friis Eriksen G, Dyrbye K, Romedahl Brown T, Krog JP, Sondergard Jensen O, Gravesen P. Microelectron Reliab 1998;38(6-8):1251-60.
22. Hirata A, Hosoya T, Machida K, Kyuragi H, Akya H. J Electrochem Soc 1996;143(11):3747-51.
23. Hirata A, Machida K, Maeyama S, Watanabe Y, Kyuragi H. Jpn J Appl Phys Part 1 1988;37(3B):1251-5.
24. Reid JS, Liu RY, Smith PM, Ruiz RP, Nicolet M-A. Thin Solid Films 1995;262:218-23.
25. Fleming JG, Roherty-Osmun E, Custer J, Smith PM, Reid JS, Nicolet M-A. In: Ellwanger RC, Wang SQ, editor. Advanced metallization and interconnect systems for ULSI applications in 1995. Mat Res Soc, Pittsburgh, PA: 1996: p. 369-373.