≥Transition in the post-etch wafer-cleaning market and technologies

Solid State Technology

Volumn 40, Issue 5, 1997, Pages 171-180

  Sargent, Jeannine ^a,b,c,d   Starov, Vladimir ^a,d,e   Rust, Werner ^a,d,f  

^a Gasonics IPC   (United States)

^b NORTHEASTERN UNIVERSITY   (United States)

^c MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^d Brandeis University ^*  (United States)

^e BRANDEIS UNIVERSITY   (United States)

^f Fairchild Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005374338     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (3)

1. C.C. Cheng et al., ECS Conference, May, 1996.
2. C.C. Cheng et al., Semiconductor FABTECH, 4th ed., London, ICG Publishing Ltd., 1996.
3. W.T. McDermott et al., Microcontamination, Oct. 1991.