Number of voids formed on a line: Parameter for electromigration lifetime

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 2, 1996, Pages 687-690

  Hinode, Kenji ^a   Kondo, Seiichi ^a   Deguchi, Osamu ^a  

^a HITACHI LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005373123     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589157     Document Type: Article

References (25)

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