Sealing AlAs against oxidative decomposition and its use in device fabrication

Applied Physics Letters

Volumn 68, Issue 14, 1996, Pages 1948-1950

  Huffaker, D L ^a   Deppe, D G ^a   Lei, C ^b   Hodge, L A ^b  

^a The University of Texas at Austin   (United States)

^b Hewlett Packard Components Group   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005300574     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.115635     Document Type: Article

References (13)

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