Contact etch scaling with contact dimension

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 16, Issue 3, 1998, Pages 1514-1518

  McNevin, S C ^a   Cerullo, M ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEEP SUB-MICRON; ETCH DEPTH; ETCH RATES; ION TRAJECTORIES; RATE LIMITING; SIDEWALL ANGLES; THEORETICAL MODELS;

ETCHING; IONS; RUTHERFORD BACKSCATTERING SPECTROSCOPY;

ASPECT RATIO;

EID: 0005263708     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.581179     Document Type: Article

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