|
Volumn 220, Issue 1-2, 1996, Pages 35-40
|
Solid-state reaction bonding of silicon carbide (HIP-SiC) below 1000°C
|
Author keywords
Chromium; Nickel; Silicon carbide (HIP SiC); Solid state reaction bonding; Ternary phase ( )
|
Indexed keywords
BONDING;
CHROMIUM;
COATED MATERIALS;
DIFFUSION IN SOLIDS;
INTERFACES (MATERIALS);
LOW TEMPERATURE EFFECTS;
MICROANALYSIS;
MORPHOLOGY;
NICKEL;
SCANNING ELECTRON MICROSCOPY;
THERMODYNAMIC STABILITY;
X RAY ANALYSIS;
DIFFUSION BONDING;
ENERGY DISPERSIVE X RAY MICROANALYSIS (EDX);
SILICON FREE HOT ISOSTATICALLY PRESSED SILICON CARBIDE (HIP-SIC);
SILICON CARBIDE;
|
EID: 0005140209
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/S0921-5093(96)10452-4 Document Type: Article |
Times cited : (31)
|
References (22)
|