Characterization of an aluminum etching process in an inductively coupled discharge using measurements of discharge impedance and current and voltage sensors

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 15, Issue 3, 1997, Pages 1250-1256

  Patrick, Roger ^a   Lee, Chii Guang ^a   Hilliker, Steven E ^a   Moeller, Ronald D ^a  

^a LAM RESEARCH CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ETCHING; ALUMINUM FILM; CHAMBER PRESSURE; CURRENT-VOLTAGE MEASUREMENTS; ETCH RATES; ETCHING SYSTEMS; EXCITATION COILS; GAS FLOWS; IMAGINARY PARTS; INDUCTIVELY COUPLED DISCHARGE; INTERCONNECT APPLICATIONS; MATCHING NETWORKS; PLASMA RESISTANCE; PROCESS CONDITION; RF CHARACTERISTICS; RF CURRENTS; TOTAL PRESSURE; TRANSFORMER-COUPLED PLASMAS; VOLTAGE SENSOR;

ALUMINUM; ELECTRIC DISCHARGES; ELECTROMAGNETIC INDUCTION; ETCHING; FLOW OF GASES;

OXIDE FILMS;

EID: 0005019789     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.580598     Document Type: Article

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