Evaluating finishes using SERA: A valuable process control tool

Printed Circuit Fabrication

Volumn 22, Issue 5, 1999, Pages 30-37

  Bratin, Peter ^a   Pavlov, Michael ^a   Chalyt, Gene ^a  

^a ECI Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0004921338     PISSN: 02748096     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. D. M Tench., "Soiderability Assessment via SERA," Journal of Applied Electrochemistry, No 24, pp. 46-50, December, 1994.
2. D. M. Tench, D. P. Anderson, Method of Assessing Solderability, U.S. Patent 5,262,022, Nov. 19, 1993.
3. J.Reed, J. Cheng, "Sequential Electrochemical Reduction Analysis (SERA) Applications on Process Characterization and Troubleshooting for Printed Circuit Board Fabrication," Proceedings of IPC Technical Conference, pp. 12-22, April, 1995.