Removing effects of temperature changes from piezoelectric impedance-based qualitative health monitoring

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3330, Issue , 1998, Pages 103-114

  Park, Gyuhae ^a   Kabeya, Kazuhisa ^a   Cudney, Harley H ^a   Inman, Daniel J ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

Damage detection; Piezoelectric material; Structural health monitoring; Temperature compensation; Temperature effect

Indexed keywords

ALGORITHMS; CONCRETE BRIDGES; DAMAGE DETECTION; DYNAMIC RESPONSE; ELECTRIC IMPEDANCE; ELECTRIC IMPEDANCE MEASUREMENT; ELECTROMECHANICAL DEVICES; HEALTH; INSTRUMENTS; INTELLIGENT STRUCTURES; MATERIALS; MEASUREMENTS; MEMS; MONITORING; PIEZOELECTRIC DEVICES; PIEZOELECTRIC MATERIALS; PIEZOELECTRIC TRANSDUCERS; PIEZOELECTRICITY; PIPE; SENSORS; STRUCTURAL ANALYSIS; STRUCTURAL DYNAMICS; STRUCTURAL HEALTH MONITORING; STRUCTURES (BUILT OBJECTS); TEMPERATURE DISTRIBUTION; THERMAL EFFECTS;

COMPENSATION TECHNIQUES; COMPUTER ALGORITHM; IMPEDANCE MEASUREMENTS; INTELLIGENT MATERIAL SYSTEMS; MECHANICAL IMPEDANCE (MI); NON DESTRUCTIVE EVALUATION (NDT) TECHNIQUES; PHY SICAL CHANGES; PIEZOELECTRIC MATERIAL; PIPE STRUCTURES; RESEARCH ISSUES; SCALE DEVELOPMENT; TEMPERATURE CHANGING; TEMPERATURE COMPENSATION; TEMPERATURE DEPENDENCIES; TEMPERATURE EFFECT;

TEMPERATURE;

EID: 0004558480     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.316963     Document Type: Conference Paper

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