The Electrodeposition & Material Properties of Palladium-Cobalt

Plating and Surface Finishing

Volumn 86, Issue 1, 1999, Pages 108-115

  Abys, Joseph A ^a   Breck, Gregory F ^a   Straschil, H K ^b,c   Boguslavsky, Irina ^d   Holmbom, Göran ^e  

^a LUCENT TECHNOLOGIES   (United States)

^b NOKIA RESEARCH CENTER   (United States)

^c VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^d Institute of Technology   (Russian Federation)

^e NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0004502746     PISSN: 03603164     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (41)

1. PROTO-AT&T Bell Labs Report, "A Heart of Palladium," Vol. 2, No. 6, 15 (1984).
2. "Palladium Coating Cuts Costs," Stacy V. Jones, The New York Times, Dec. 8, 1984.
3. "All That Glitters Is Not Gold", Ellen Sweets, RECORD, AT&T Bell Laboratories, p. 4, (Jan. 1985).
4. J.A. Abys, Proc. 2nd AES Symposium on Economic Use of and Substitution for Precious Metals in the Electronics Industry, Danvers, MA, Oct. 5-6, 1987.
5. J.A. Abys, Proc. Connectors '87, Inst. Metal Fin., Coventry, England, 1987.
6. E.J. Kudrak et al., Plat. and Surf. Fin., 78, 57 (Mar. 1991).
7. J.A. Abys et al., Metal Fin., 89, 43 (July 1991).
8. E.J. Kudrak et al., Plat. and Surf. Fin. 79, 49 (Feb. 1992).
9. E.J. Kudrak & J.A. Abys, Interconnection Technol., 18 (June 1993).
10. E.J. Kudrak et al., Proc. SAE Int'l Congress and Expos., (Feb. 1996).
11. M. Antler, Platinum Metal Review, 31(1), 13 (1987).
12. J.L. Chao & R.R. Gore, Proc. AESF SUR/FIN® '91, Session I, Toronto, Ont., Canada.
13. K. Horibe & T. Hirano, Proc. AESF SUR/FIN '91, Session F, Toronto, Ont., Canada.
14. Gravitz, D., Electronic Pkg. & Prod. (Feb. 1982).
15. European Pat. Appl. 87-305080.1 by Texas Instruments (1987).
16. European Pat. Appl. 89-302939.7 by Texas Instruments (1989).
17. th Ann. Holm Conf. on Elec. Contacts, Chicago, IL, p. 41 (1980).
18. A.H. Graham, ibid., p. 61 (1980).
19. T. Sato et al., Plat. and Surf. Fin., 74, 55 (Aug. 1987).
20. M. Antler, Trans. ASLE, 26(3), 376 (1983).
21. W.O. Freitag, Proc. Holm Seminar on Elec. Contacts, p. 17, Chicago, IL, (1975).
22. M.J. Pike-Biegunski & R.J. Bazonne, Proc. 2nd AES Symp. on Economic Use of and Substitution for Precious Metals in the Electronics Industry, Danvers, MA (1982).
23. K.J. Whitlaw, Trans. Inst. Metal Fin., 60, 141 (1982).
24. Wilkinson, ibid., 60, 152 (1982).
25. K.J. Whitlaw, ibid., 64, 62 (1986).
26. B. O'Hara, ibid., 60, 156 (1982).
27. D. Mason, Plat. and Surf. Fin. 72, 16 (July 1985); 72, 14 (Aug. 1985).
28. D. Mason, Plat. and Surf. Fin. 72, 16 (July 1985); 72, 14 (Aug. 1985).
29. D. Walz, & C.J. Raub, Metalloberfläche, 40, 162, 199, (1986).
30. A.H. Graham, et al., Proc. 2nd AES Symp. on Econ. Use of & Substitution for Precious Metals in the Electronics Industry, Danvers, MA (1987).
31. B. Graves, Prod. Fin, 46 (Jan. 1994).
32. I. Boguslavsky et al., Proc. AESF SUR/FIN® '98, Session L, Minneapolis, MN (1998).
33. G. Holmbom et al., ibid. (1998).
34. J.A. Abys, Proc. Fleck Mater. Conf., Indian Wells, CA, (Sept. 1998).
35. E.J. Kudrak et al., Proc. Ann. Symp. IICIT, Boston, MA (Oct. 1998).
36. Press Releases: "AMP Unveils Next Generation of Connector Contact Finishes," October 9, 1998; "Lucent Technologies Electroplating Chemicals & Services Venture Develops High- Performance Material for Connector Contacts," October 21, 1998.
37. Press Releases: "AMP Unveils Next Generation of Connector Contact Finishes," October 9, 1998; "Lucent Technologies Electroplating Chemicals & Services Venture Develops High-Performance Material for Connector Contacts," October 21, 1998.
38. R.J. Morrissey, Metal Finishing Guidebook, 89(1A), 256 (1991).
39. I. Boguslavsky et al., Proc. AESF SUR/FIN® '97, Session I, Detroit, MI. (1997).
40. R. Sard et al., Properties of Electrodeposits - Their Measurements and Significance, The Electrochemical Society, Inc., Princeton, NJ, 1975; p. 71.
41. A. Brenner et al., Plating, 37, 36 (1950).