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Volumn 3224, Issue , 1997, Pages 352-359
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Three-dimensional silicon microcomponents manufactured by micro-electro discharge machining
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Author keywords
Electro discharge machining; Electrode; Manufacturing; Microgears; Micromirror; Microspring; Microsystems; Three dimensional
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Indexed keywords
BEVEL GEARS;
CONCURRENT ENGINEERING;
ELECTRIC DIPOLE MOMENTS;
ELECTRIC DISCHARGE MACHINING;
ELECTRODES;
ELECTROLYSIS;
ETCHING;
JOB ANALYSIS;
LITHOGRAPHY;
MACHINING;
MICROMACHINING;
MICROSTRUCTURE;
MICROSYSTEMS;
OPTICAL DEVICES;
RAPID PROTOTYPING;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
SPUR GEARS;
THREE DIMENSIONAL;
ACCELERATION SENSORS;
CONVENTIONAL MACHINING;
ELECTRIC FORCES;
ELECTRICAL DISCHARGES;
ELECTRO DISCHARGES;
ELECTRO-DISCHARGE MACHINING;
ELECTRODE WEARS;
ETCHING TECHNIQUES;
HIGH ACCURACIES;
INSTALLATION COSTS;
LARGE DESIGNS;
MACHINING COMPLEXES;
MACHINING PARAMETERS;
MATERIAL REMOVALS;
MICRO COMPONENTS;
MICRO MIRRORS;
MICROGEARS;
MICROMIRROR;
MICROSPRING;
PRODUCTION TECHNOLOGIES;
RELIABLE METHODS;
SILICON MICRO COMPONENTS;
SMALL SIZES;
TOOL ELECTRODES;
WORK PIECES;
ELECTRIC DISCHARGES;
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EID: 0004499749
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.284535 Document Type: Conference Paper |
Times cited : (5)
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References (10)
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