Highly accurate and quick bonding for planar lightwave circuit and laser-diode chip

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 133-137

  Sawada, R ^a   Nakada, H ^b   Ohira, F ^a  

^a NTT CORPORATION   (Japan)

^b NIT Advanced Technology Corporation   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTRONICS; OPTICAL WAVEGUIDES; TIMING CIRCUITS;

AUTO-FOCUSING; BONDING EQUIPMENT; BONDING PROCESS; HIGHLY ACCURATE; PICKING UP; PLANAR LIGHT-WAVE CIRCUITS; WAVEGUIDE CIRCUITS;

DIODES;

EID: 0003906360     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704539     Document Type: Conference Paper

References (4)

1. T. Hashimoto, et al., "Hybrid Integration of a Laser Diode Chip on a Planar Lightwave Circuit Platform by the Passive Alignment Method" MOC'95.
2. N. Nakajima, Denshi Zairyou, April (1995) 93-96 (in Japanese). Shinji Hara, Hiroshi Nakada, Renshi Sawada
3. Yoshihiro Isomura, "High-Precision Bonding of Semiconductor Laser Diodes" Int. J. Japan Spc. Prec. Eng., vo1. 27, no. 1, (Mar, 1993) 49-53.
4. J. Nieweglowski, et al., IEEE Trans. on Consumer Electronics, vol. 39, no. 3 (1993)141-150