Mechanical and thermal effects in grinding of advanced ceramics

International Journal of the Japan Society for Precision Engineering

Volumn 33, Issue 1, 1999, Pages 32-36

  Tönshoff, Hans Kurt ^a   Friemuth, Thomas ^a   Hessel, Dirk ^a   Lierse, Tjark ^b  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^b Dr Kaiser Diamond Tools   (Germany)

Author keywords

Ceramics; Grinding; Heated specimens; Material removal mechanisms; Residual stresses

Indexed keywords

EID: 0003863788     PISSN: 0916782X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

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2. Wobker, H.-G.: Schleifen keramischer Werkstoffe, Dr.-Ing. Diss. Univ. Hannover 1992
3. Tönshoff, H.K.; Paul T.; et al.: Modelling and Simulation of Grinding Processes, Annals of the CIRP 41 (1992) 2, pp. 677-688
4. Takazawa, K., Thermal Aspects of the Grinding Operation, Ind. Diam. Rev., April 1972, pp. 143-149
5. Tönshoff, H.K.; Lierse, T.; Winkler, J.: Thin-Film Temperature Measurement Sensors for Research Applications - Grinding and Turning, Int. Symp. on local strain and temp, meas., Berlin 14-15 March 1996
6. Jaeger, J.C.: Moving Sources of Heat and the Temperature in Sliding Contacts, Proc. of the Royal Soc. of New Wales, 76 (1942), S. 203-224
7. Kingery, W.D.: Introduction to Ceramics, John Wiley & Sohn, Inc. 1975
8. B. Eigenmann: Röntgenographische Analyse inhomogener Spannungszustände in Keramiken, Keramik-Metall-Fügeverbindungen und dünnen Schichten, Dr.-Ing. Diss. Univ. Karlsruhe, 1990