ATE Failure Isolation Methodologies for Failure Analysis, Design Debug and Yield Enhancement

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 1998, Pages 235-244

  Patrick, D S ^a   Wagner, L C ^a   Nguyen, P T ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ISOLATION TECHNIQUES; WAFERS;

COMPUTER HARDWARE; COMPUTER SIMULATION; CUSTOMER SATISFACTION; ELECTRIC POWER SYSTEMS; ELECTRON BEAMS; LIQUID CRYSTALS; MACHINE DESIGN; MICROSCOPES; VACUUM; VECTORS;

CMOS INTEGRATED CIRCUITS;

EID: 0003709993     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)

1. S. Kudya, et al, "The Sematech Failure Analysis Roadmap", ASM International Symposium for Testing and Failure Analysis (ISTFA), 1995.
2. G. Shade, "Physical Mechanisms for Light Emission Microscopy", ASM International Symposium for Testing and Failure Analysis (ISTFA), 1990.
3. D. Burgess, "Advanced Liquid Crystal for Improved Hot Spot Detection Sensitivity", ASM International Symposium for Testing and Failure Analysis (ISTFA), 1992.