Non-hermetic Encapsulation and Assembly Techniques for Optoelectronic Applications

Microelectronics International: An International Journal

Volumn 13, Issue 1, 1996, Pages 6-10

  Hall, I P ^a  

^a MARTLESHAM HEATH   (United Kingdom)

Author keywords

Silicone gels

Indexed keywords

EID: 0003685492     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565369610800197     Document Type: Article

References (4)

1. Lealman, I.F. et al., ‘1.56 μm InGaAsP/InP Tapered Active Layer Multiquantum Well Laser with Improved Coupling to Cleaved Singlemode Fibre’, Electronic Letters, Vol. 30, No. 11, pp. 857-858, May (1994).
2. Balde, J.W., ‘The Effectiveness of Silicone Gels’, IEEE Transactions on Components, Hybrids, and Manufacturing Technologies, Vol. CHMT-14, No. 2, June (1991’.
3. Hall, I.P., ‘Novel Techniques for Low-cost, High Performance Optoelectronic Component Assembly’, Hybrid Circuits, No. 34, pp. 44-47, May (1994).
4. Collins, J.V. et al., ‘Technology Developments for Low Cost Laser Packaging’, Proceedings OFC '95, San Diego, CA, March (1995).