Direct bonding between spacer and field emitter array using an electron-beam evaporated interlayer

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3046, Issue , 1997, Pages 328-335

  Park, Heung Woo ^a   Ju, Byeong Kwon ^a   Lee, Yun Hi ^a   Kang, In Byeong ^b   Samaan, N ^b   Haskard, M R ^b   Park, Jung Ho ^c   Oh, Myung Hwan ^a  

^a Korea Institute of Science and Technology   (South Korea)

^b UNIVERSITY OF SOUTH AUSTRALIA   (Australia)

^c Korea University   (South Korea)

Author keywords

Direct bonding; Hydrophilization; Interlayer; Micro electro mechanical systems; Silicon on insulators

Indexed keywords

AMMONIUM HYDROXIDE; ATOMIC FORCE MICROSCOPY; ELECTRON BEAMS; INTERFACIAL ENERGY; MEMS; SCANNING ELECTRON MICROSCOPY; SILICON NITRIDE; SILICON ON INSULATOR TECHNOLOGY; SILICON OXIDES; SURFACE ROUGHNESS; TENSILE STRENGTH; WAFER BONDING;

DIRECT BONDING; EVAPORATED SILICON; FIELD EMITTER ARRAYS; HIGH-RESOLUTION SCANNING ELECTRON MICROSCOPES; HYDROPHILIZATION; INTERLAYER; MICRO ELECTRO MECHANICAL SYSTEM; PROPAGATION METHOD;

SILICON WAFERS;

EID: 0003159856     PISSN: 0277786X     EISSN: 1996756X     Source Type: Conference Proceeding    
DOI: 10.1117/12.276623     Document Type: Conference Paper

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