Film property comparison of Ti/TiN deposited by collimated and uncollimated physical vapor deposition techniques

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 3, 1996, Pages 1837-1845

  Wang, Shi Qing ^a,b   Schlueter, J ^a  

^a SEMATECH   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0003088155     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.588564     Document Type: Article

References (14)

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