A novel circuit fabrication technique using offset lithography

Journal of Electronics Manufacturing

Volumn 7, Issue 1, 1997, Pages 63-67

  Ramsey, B J ^a   Evans, P S A ^a   Harrison, D ^a  

^a BRUNEL UNIVERSITY   (United Kingdom)

Author keywords

Circuit boards; Conductive inks; Film circuits; Microwave structures; Offset lithography; Printed films; Printing

Indexed keywords

EID: 0002952155     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313197000075     Document Type: Article

References (6)

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2. P. Sozeck, "Two novel additive processes to manufacture circuit boards: Direct laser writing and direct electrostatic transfer and deposition", IEEE Trans. on Components, Hybrids, and Manufacturing Technology 12(2) (1989).
3. S. Penderson, C. Wilson, G. Pitts and W. Stotesbury, "1996 electronics industry environmental roadmap", Microelectronics & Computer Tech. Corporation. Doc. No. MCC-ECESN-001-96 (1990).
4. R. M. Scarisbrick, "Electrically conducting mixtures", J. Phys. D: Appl. Phys. 6 (1973). Central Electricity Research Laboratories, Leatherhead, Surrey, UK.
5. P. R. Shepherd, P. S. A. Evans, B. J. Ramsey and D. J. Harrison, "Assessment of conductive lithographic films for microwave applications", Automated R. F. and Microwave Measurement Society Conference. Limpley Stoke, Bath, UK (1996).
6. T. H. Stearns, "Flexible printed circuitry", McGraw-Hill (1995), pp. 110, 240.