Prototype of a microtesting system made by the LIGA process to measure the young’s modulus in cantilever microbeams

Journal of Dynamic Systems, Measurement and Control, Transactions of the ASME

Volumn 119, Issue 1, 1997, Pages 57-60

  Ruther, P ^a   Bacher, W ^a   Feit, K ^a   Maas, D ^a   Menz, W ^a,b  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

^b UNIVERSITY OF FREIBURG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002787735     PISSN: 00220434     EISSN: 15289028     Source Type: Journal    
DOI: 10.1115/1.2801214     Document Type: Article

References (8)

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2. Göttert, J., Mohr, J., Müller, C., and Sauter, H., 1992, “Coupling Elements for Multimode Fibers by the LIGA Process,”Proc. MICROSYSTEM Technologies 92, Berlin, Germany, pp. 297-307.
3. Guckel, H., Skrobis, K. J., Christenson, T. R., Klein, J., Han, S., Choi, B., and Lovell, E. G., 1991, “On the Application of Deep X-Ray Lithography with Sacrificial Layers to Sensor and Actuator Construction,”Proc. TRANSDUCRS’91, San Francisco, pp. 393-396.
4. Johansson, S., Schweitz, J.-A., Tenerz, L., and Tiren, J., 1988, “Fracture Testing of Silicon Microelements in situ in a Scanning Electron Microscope,”J. Appl. Phys., Vol. 63, No. 10, pp. 4799-4803.
5. Maas, D., Büstgens, B., Fahrenberg, J., Keller, W., and Seidel, D., 1994, “Application of Adhesive Bonding for Integration of Microfluidic Components,”Proc. ACTUATOR 94, Bremen, Germany, pp. 75-78.
6. Mohr, J., Burbaum, C., Bley, P., Menz, W., Waílrabe, V., 1990, “Movable Microstructures Manufactured by the LIGA-Process as Basic Elements for Microsystems” H. Reichl, ed., MICROSYSTEM Technologies 90, VDE-Verlag, Berlin, pp. 529-537.
7. Ruther, P., Bacher, W., Feit, K., Heckele, M., and Weindel, K., 1994, “LIGAmade Pneumatically Driven Micro-actuator for Use in a Micro Testing System,”Proc. MICROSYSTEM Technologies 94, Berlin, Germany, pp. 899-906.
8. Weihs, T. P., Hong, S., Bravman, J. C., and Nix, W. D., 1988, “Mechanical Deflection of Cantilever Microbeams: A New Technique for Testing the Mechanical Properties of Thin Films,”J. Mater. Res., Vol. 3, No. 5, pp. 931-942.