Wafer-level packaging gains momentum

Solid State Technology

Volumn 42, Issue 4, 1999, Pages 45-50

  Elenius, Peter ^a  

^a Flip Chip Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002775985     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (1)

1. "Wafer-level burn-in will cut time and cost," Solid State Technology, p. 20, November 1998.