Numerical approach to calculate thermal expansion of honeycomb sandwich panel with composite face sheets

Advanced Composite Materials

Volumn 9, Issue 4, 2000, Pages 387-400

  Kabashima, Shigenori ^a   Ozaki, Tsuyoshi ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

Author keywords

Adhesives; Coefficient of thermal expansion; Finite element method; Honeycomb sandwich panel

Indexed keywords

EID: 0002706142     PISSN: 09243046     EISSN: 15685519     Source Type: Journal    
DOI: 10.1163/15685510052000101     Document Type: Article

References (17)

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