Laser through-hole drilling and laser cutting in teflon

Applied Physics A Materials Science & Processing

Volumn 60, Issue 1, 1995, Pages 27-30

  Haba, B ^a   Morishige, Y ^a   Kishida, S ^a  

^a NEC CORPORATION   (Japan)

Author keywords

42.55.Lt; 42.60.By; 77.55; 81.40.Vw

Indexed keywords

EID: 0002676723     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/BF01577608     Document Type: Article

References (6)

1. Ablation of polytetrafluoroethylene (Teflon) with femtosecond UV excimer laser pulses