Use of a helicon-wave excited plasma for aluminum-doped ZnO thin-film sputtering

Applied Physics Letters

Volumn 72, Issue 2, 1998, Pages 235-237

  Yamaya, K ^a   Yamaki, Y ^a   Nakanishi, H ^a   Chichibu, S ^a  

^a TOKYO UNIVERSITY OF SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002648516     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.120707     Document Type: Article

References (17)

1. See, for example, J. R. Tuttle, J. S. Ward, T. A. Berens, A. Duda, M. A. Contreas, K. R. Ramanathan, A. L. Tennant, J. Keane, E. D. Cole, and R. Noufi, Mater. Res. Soc. Symp. Proc. 426, 143 (1996).
2. T. Minami, K. Oohashi, and S. Takata, Thin Solid Films 193/194, 721 (1990).
3. T. Minami, H. Sato, H. Nanto, and S. Takata, Jpn. J. Appl. Phys., Part 2 24, L781 (1985).
4. J. Hu and R. G. Gordon, J. Appl. Phys. 71, 880 (1992).
5. D. Raviendra and J. K. Sharma, J. Appl. Phys. 58, 838 (1985).
6. A. F. Akataruzzaman, G. L. Sharma, and L. K. Malhotra, Thin Solid Films 198, 67 (1991).
7. A. Suzuki, T. Matsushita, N. Wada, Y. Sakamoto, and M. Okuda, Jpn. J. Appl. Phys., Part 2 35, L56 (1996).
8. F. F. Chen, Plasma Phys. Controlled Fusion 33, 339 (1991).
9. F. F. Chen, J. Vac. Sci. Technol. A 10, 1389 (1992).
10. R. W. Boswell, Proceedings of the 21st International Conference on Phenomena in Ionized Gases, edited by G. Ecker, U. Arendt, J. Boseler, and A. Brunn (Arbeitsgemeinschaft Plasma Physik, Bochum, 1993), p. 18.
11. H. Sugai, Oyo Buturi 63, 559 (1994) (in Japanese).
12. N. Tanaka, H. Okano, Y. Kobayashi, T. Usuki, and K. Shibata, Jpn. J. Appl. Phys., Part 1 33, 5249 (1994).
13. See, for example, A. J. Perry and R. W. Boswell, Appl. Phys. Lett. 55, 148 (1989).
14. M. Koike and I. H. Suzuki, Jpn. J. Appl. Phys., Part 1 34, 6754 (1995).
15. T. Watari, Phys. Fluids 21, 2078 (1978).
16. T. Minami, H. Sato, S. Takata, N. Ogawa, and T. Mouri, Jpn. J. Appl. Phys., Part 2 31, L1106 (1992).
17. T. Minami, H. Sato, H. Imamoto, and S. Takata, Jpn. J. Appl. Phys., Part 2 31, L257 (1992).