An approach to MEM sensor array packaging

Advancing Microelectronics

Volumn 27, Issue 6, 2000, Pages 16-18

  Soucy, Joseph W ^a   Haley, Jason F ^a   Marinis, Thomas F ^a  

^a CHARLES STARK DRAPER LABORATORY   (United States)

Author keywords

Flip chip; Gold ball bumping; LTCC BGA; MEM sensors; Solder bumping

Indexed keywords

EID: 0002613544     PISSN: None     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. David L. Wilcox, Rong Fong Huang, and Rich Kommrusch, Advancing Microelectronics 26 (4), July/August 1999, pp.15-20.
2. Homi C. Bhedwar and Howard T. Sawhill, Electronic Materials Handbook, Vol 1 Packaging, American Society for Metals, Metals Park, Ohio, 1989, pp. 460-469.
3. DuPont Green Tape™ Material System Design and Layout Guideline, http://www.dupont.com/mcmc