Microfabrication of high aspect ratio Bi-Te alloy microposts and applications in micro-sized cooling probes

Microsystem Technologies

Volumn 6, Issue 1, 1999, Pages 1-5

  Huang, L ^a   Wang, W ^a   Murphy, M C ^a  

^a LOUISIANA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0002534105     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050165     Document Type: Article

References (11)

1. BeMent SL; Wise KD; Anderson DJ; Najafi K; Drake KL (1986) Solid state electrodes for multichannel multiplexed intracortical neuronal recording. IEEE Trans Biomed Eng, BME-33(2):230-241.
2. Clearfield HM; McNamara DK; Davis GD (1991) Adherenal surface preparation for structural adhesive bonding. In Adhesive bonding. ed. Lee, L-H, pp. 215-217, New York City, NY: Plenium Press.
3. Goldsmid HJ (1986). Electronic refrigeration. London, UK: Pion Ltd.
4. Jones KE; Campbell PK; Normann RA (1992) A glass/silicon composite intracortical electrode array. Ann Biomed Eng 20:423-437.
5. 3 films. eds Mathiprakasam, B; Heenan, P, Thirteenth Int Conf on Thermoelectrics, pp. 277-281. Kansas City, MO: American Institute of Physics.
6. Magri P (1996) Clotilde Boulanger and Jean-Marie Lecuire Synthesis, properties and performances of electrodeposited bismuth telluride films. J Mater Chem 6(5):773-779.
7. 3 thin film thermocouple. Solid-State Electron 35(9):1269-1272.
8. Takahashi M; Oda Y; Ogino T; Furuta S (1993) Electrodeposition of Bi-Te alloy films. J. Electrochem Soc 140(9):2550-2553.
9. Takahashi M; Katou Y; Nagata K; Furuta S (1994) The composition and conductivity of electrodeposited Bi-Te alloy films. Thin Solid Films, 240:70-72.
10. 3 films. Thin Solid Films, 187(2):253-262.
11. Yim WM; Rosi FD (1972) Compound tellurides and their alloys for Peltier cooling-A review. J. Solid State Electron 15:1131-1140.