Embedded passive components and PCB size -thermal effects

Microelectronics International

Volumn 17, Issue 2, 2000, Pages 7-10

  Stubbs, D M ^a   Pulko, S H ^a   Wilkinson, A J ^a   Wilson, B ^b   Christiaens, F ^c   Allaert, K ^c  

^a UNIVERSITY OF HULL   (United Kingdom)

^b UNIVERSITY OF MANCHESTER   (United Kingdom)

^c LUCENT TECHNOLOGIES   (United States)

Author keywords

Heat; Printed circuit boards; Resistors; Simulation; Thermal testing

Indexed keywords

EID: 0002322162     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360010332372     Document Type: Article

References (10)

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2. DeCogan, D. (1998), "Transmission line matrix (TLM) techniques for diffusion applications", Gordan and Breach, Cooper Station, NY
3. Frye, R.C., Yeong, J.Y., Smoth, P.R. and Yicheng, L. (1999), "Integrated spiral transformers", 1999 International Conference on High Density Packaging and MCMs, pp. 438-43.
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8. Wijeyesekera, S., Patel, N., Bolton, P.C. and Clearfiled, H.M. (1999), "Development of wafer level packaging for integrated passive devices", 1999 International Conference on High Density Packaging and MCMs, pp. 450-4.
9. Witwit, A.R.M., Stubbs, D.M., Pulko, S.H. and Wilkinson, A.J. (1998a), "TLM thermal modelling of integrated resistors within PCB materials". Proceedings of the 17th International Conference on Modelling, Identification and Control, pp. 162-5.
10. Witwit, A.R.M., Stubbs, D.M., Pulko, S.H. and Wilkinson, A.J. (1998b), "Thermal simulation of PCBs with embedded resistors", Proceedings of IEE Simulation '98 Conference, pp. 313-6.