Rapid solidification of Cu-25at.% Ni alloy: Molecular dynamics simulations using embedded atom method

Materials Science and Engineering: A

Volumn 214, Issue 1-2, 1996, Pages 139-145

  Chen, Kuiying ^a   Sha, Xianwei ^a   Zhang, Xiumu ^a   Li, Yiyi ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL BONDS; COMPUTER SIMULATION; CORRELATION METHODS; CRYSTAL SYMMETRY; MATHEMATICAL MODELS; MICROSTRUCTURE; MOLECULAR DYNAMICS; ORDER DISORDER TRANSITIONS; SOLIDIFICATION; THERMAL EFFECTS;

EMBEDDED ATOM METHOD (EAM); FABER ZIMAN STRUCTURE FACTORS; FACED CENTERED CUBIC (FCC) STRUCTURES; HEXAGONAL CLOSED PACKED (HCP) STRUCTURES; STRUCTURE EVOLUTION;

COPPER ALLOYS;

EID: 0002299035     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/0921-5093(96)10207-0     Document Type: Article

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