Ionized magnetron sputtering for lining and filling trenches and vias

Semiconductor International

Volumn 19, Issue 2, 1996, Pages 99-102

  Rossnagel, S M ^a  

^a IBM RESEARCH   (United States)

Author keywords

Ionized magnetron PVD (I PVD); Physical vapor deposition (PVD); PVD sidewall coverage; Sputtering

Indexed keywords

EID: 0002154315     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (10)

1. D.J. Mikalsen and S.M. Rossnagel, U.S. Pat. 4824544, 1989.
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3. M. Barnes, J. Forster and J. Keller, U.S. Pat: 5178739, 1993.
4. S.M. Rossnagel and J. Hopwood, APL 63, 1993, p. 3285.
5. S.M. Rossnagel and J. Hopwood, JVST B12, 1994, p. 449.
6. S. Hamaguchi and S.M. Rossnagel, JVST B13, 1995.
7. S.M. Rossnagel, JVST A13, 1995, p. 125.
8. Y-W. Kim, J. Moser, I. Petrov, J.E. Greene and S.M. Rossnagel, JVST A12, 1995, p. 3169.
9. D. Gardner and D.B. Fraser, Prod. 12th VMIC, June 1995, p. 287.
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