Study on fabrication of high aspect ratio MEMS microparts using a compact SR beamline

Microsystem Technologies

Volumn 4, Issue 2, 1998, Pages 61-63

  Sugiyama, S ^a   Zhang, Y ^b   Hosaka, M ^a   Ueno, H ^a   Tabata, O ^a   Konishi, S ^a   Maeda, R ^c  

^a RITSUMEIKAN UNIVERSITY   (Japan)

^b SUMITOMO HEAVY INDUSTRIES LTD   (Japan)

^c NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001874880     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050095     Document Type: Article

References (7)

1. Ehrfeld W; Bley P; Gotz F; Mohr J; Münchenmeyer D; Schelb W; Baving HJ; Beets D: (1988) Progress in deep-etch synchrotron radiation lithography. J. Vac. Sci. Technol. B6: 178-182
2. Guckel H: (1996) Deep x-ray lithography for micromechanics and precision engineering, Rev. Sci. Inhstrum. 67:3357
3. Khan Malek C; Vladimirsky Y; Vladimirsky O; Scott J; Craft B; Saile V: (1996) X-ray microfabrication activities at the Center for Advanced Microstructures and Devices (CAMD). Rev. Sci. Instrum. 67: 3378-3379
4. Menz W; Bley P: (1993) Mikrosystemtechnik für Ingenieure, pp. 200-209. Weinhiem, New York, Basel, Cambridge: VCH
5. Miyajima H; Mehregany M: (1995) High-aspect-ratio photolithography for MEMS applications. J. Microelectromechanical Systems. 4: 220-229
6. Mohr J; Ehrfeld W; Münchmeyer D: (1988) Requirements on resist layers in deep-etch synchrotron radiation lithography. J. Vac. Sci. Technol. B6: 2264-2267
7. th Symposium on Micro Machine and Human Science, pp. 79-84. Nagoya: IEEE