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Volumn 78, Issue 2, 1996, Pages 193-210

A single leg bending test for interfacial fracture toughness determination

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0001844390     PISSN: 03769429     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF00034525     Document Type: Article
Times cited : (113)

References (22)
  • 20
    • 0029424978 scopus 로고
    • T.Y. Wu, W.T. Chen, R.A. Pearson and D.T. Read (eds.), American Society of Mechanical Engineers, New York
    • V. Sundararaman and B.D. Davidson, in Application of Fracture Mechanics in Electronic Packaging and Materials, EEP Vol. 11/MD Vol. 64, T.Y. Wu, W.T. Chen, R.A. Pearson and D.T. Read (eds.), American Society of Mechanical Engineers, New York (1995), 141-154.
    • (1995) Application of Fracture Mechanics in Electronic Packaging and Materials , vol.64 EEP VOL. 11-MD VOL , pp. 141-154
    • Sundararaman, V.1    Davidson, B.D.2
  • 21
    • 0346323478 scopus 로고
    • An Unsymmetric End Notched Flexure Test for Interfacial Fracture Toughness Determination
    • Department of Mechanical, Aerospace and Manufacturing Engineering, Syracuse University, Syracuse, NY
    • V. Sundararaman and B.D. Davidson, An Unsymmetric End Notched Flexure Test for Interfacial Fracture Toughness Determination, Technical Report 94-203, Department of Mechanical, Aerospace and Manufacturing Engineering, Syracuse University, Syracuse, NY (1995).
    • (1995) Technical Report , vol.94-203
    • Sundararaman, V.1    Davidson, B.D.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.