Simulation of uniformity and lifetime effects in collimated sputtering

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 2, 1996, Pages 679-686

  Tait, R N ^a   Dew, S K ^b   Tsai, W ^c   Hodul, D ^c   Smy, T ^d   Brett, M J ^b  

^a Alberta Microelectronic Centre   (Canada)

^b UNIVERSITY OF ALBERTA   (Canada)

^c VARIAN MEDICAL SYSTEMS   (United States)

^d CARLETON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001754989     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589156     Document Type: Article

References (20)

1. L. Quellet, R. Reynolds, and Y-K. Kim, presented at Semicon, Korea, November, 1992 (unpublished).
2. M. F. Chisholm, G. A. Dixit, M. K. Jain, R. H. Havemann, and T. Weaver, Proceedings of the 1994 VLSI Multilevel Interconnection Conference, June 7, 8 (unpublished), pp. 22-28.
3. S. M. Rossnagel, D. Mikalsen, H. Kinoshita, and J. J. Cuomo, J. Vac. Sci. Technol. A 9, 261 (1991).
4. S. K. Dew, J. Appl. Phys. 76, 4857 (1994).
5. Z. Lin and T. S. Cale, in Ref. 2, p. 552.
6. B. Vollmer, T. Licata, D. Restaino, and J. Ryan, Thin Solid Films 247, 104 (1994).
7. C. F. Hoener, E. Pylant, E. G. Boden, and S.-Q. Wang, J. Vac. Sci. Technol. B 12, 1394 (1994).
8. D. S. Bang, J. P. McVittie, M. M. Islamraja, K. C. Saraswat, Z. Krivokapic, S. Ramaswami, and R. Cheung, in 10th Symposium on Plasma Processing, Elec. Chem. Soc., San Francisco, May, 1994 (unpublished).
9. D. S. Bang, J. P. McVittie, M. M. Islamraja, K. C. Saraswat, Z. Krivokapic, S. Ramaswami, and R. Cheung, in Ref. 2, pp. 554.
10. T. Smy, K. L. Westra, and M. J. Brett, IEEE Trans. Electron Devices ED-37, 591 (1990).
11. S. Dew, T. Smy, and M. Brett, Jpn. J. Appl. Phys. 33, 1140 (1994).
12. S. K. Dew, D. Liu, M. J. Brett, and T. Smy, J. Vac. Sci. Technol. B 11, 1281 (1993).
13. D. Liu, T. Janacek, S. K. Dew, M. J. Brett, T. Smy, and W. Tsai, Thin Solid Films 236, 267 (1993).
14. F. H. Baumann, R. Liu, C. B. Case, and W. Y-C. Lai, in Proceedings of the 1993 VLSI Multilevel Interconnection Conference (unpublished), pp. 412-417.
15. S. Ramaswami, J. Iacoponi, R. Cheung, J. Egermeier, G. Chen, and A. Tepman, in Ref. 14, pp. 439-441.
16. J. Nulman et al., in Proceedings of the Second International Symposium on Sputtering and Plasma Processes, Tokyo, Japan, May 27, 28, 1993 (unpublished).
17. A. Ohsaki, K. Maekawa, M. Fujisawa, Y. Itoh, M. Fujinaga, and H. Kotani, in Ref. 16.
18. G. A. Dixit et al., Proceedings of the SPIE Multilevel Interconnection Conference, 1993 (unpublished), Vol. 2090, p. 12.
19. S. K. Dew (private communication).
20. H. Ito, N. Kajita, M. Hanai, Y. Hashimoto, N. Tanaka, and H. Yoshida, extended abstract in Solid State Devices and Materials, 1993 (unpublished), p. 177.