Thermal characteristics of a multichip module using PF-5060 and water

KSME International Journal

Volumn 13, Issue 5, 1999, Pages 443-450

  Choi, Mingoo ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

Heat Transfer Coefficient; Modified Blasius Equation; Multichip Module; Nusselt Number; Rectangular Channel

Indexed keywords

EID: 0001613757     PISSN: 12264865     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02939332     Document Type: Article

References (3)

1. Baker, E., 1972, "Liquid Cooling of Microelectronic Devices by Free and Forced Convection," Microelectronics and Reliability, Vol. 11, pp. 213-222.
2. Bar-Cohen, A., 1994, "Trends in the Packaging of Computer Systems," In Cooling of Electronic Systems (Edited by Kakac, C., Yuncu, H. and Hijikata, K.), Kluwer Academic Publishers, Dordrecht, pp. 17-45.
3. Hartnett, J. P. Kostic, M, 1989, "Heat Transfer to Newtonian and Non-Newtonian Fluids in Rectangular Ducts," Advances in heat transfer, Vol. 19, pp. 247-356.