Pulse-modulated RF thermal plasma for advanced materials processing

Journal of Intelligent Material Systems and Structures

Volumn 10, Issue 7, 1999, Pages 565-568

  Ishigaki, Takamasa ^a   Sakuta, Tadahiro ^b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b KANAZAWA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ARGON; DEPOSITION; ELECTRIC CURRENTS; HYDROGEN; PLASMA SOURCES; SPRAYING; SYNTHESIS (CHEMICAL); TEMPERATURE; TIME DOMAIN ANALYSIS;

COIL CURRENT AMPLITUDE; MATERIALS PROCESSING; PLASMA GENERATION; PULSE MODULATED PLASMA; THERMAL PLASMA; TIME DOMAIN CONTROLLED GENERATION;

PLASMA APPLICATIONS;

EID: 0001537720     PISSN: 1045389X     EISSN: None     Source Type: Journal    
DOI: 10.1106/4JNK-F951-UQ6F-VWER     Document Type: Article

References (7)

1. Fey, F. H. A.G. et al. 1991. "Instantaneous and Delayed Responses of Line Intensities to Interruption of the RF Power in an Argon Inductively Coupled Plasma," Spectrochim. Acta, 46B, 885-900.
2. Ishigaki, T. et al. 1996. "Thermal Plasma Treatment of Titanium Carbide Powders: Part II. In-flight Formation of Carbon-site Vacancies and Subsequent Nitridation in Titanium Carbide Powders during Induction Plasma Treatment," J. Mater. Res., 11(11):2811-2824.
3. Ishigaki, T. et al. 1997. "Generation of Pulse-Modulated Induction Thermal Plasma at Atmospheric Pressure," Appl. Phys. Lett., 71(26):3787-3789.
4. Mostaghimi, J. et al. 1998, "Transient Response of the Radio Frequency In-ductively Coupled Plasma to a Sudden Change in Power," J. Appl. Phys., 83(4):1898-1908.
5. De Regt, J. M. et al. 1995, "Response of the Electron density and Temperature to the Power interruption Measured by Thomson Scattering in an Inductively Coupled Plasma," Phy. Rev. E, 52(3):2982-2987.
6. Sakuta, T. et al. 1993. "Effects of Plasma Diameter and Operating Frequency on Dynamic Behavior of Induction Thermal Plasma," Plasma Sources Sci. Technol., 2(1):67-71.
7. Sakuta, T. et al. 1999. "Experimentally Diagnosed Transient Behavior of Pulse Modulated Inductively Coupled Thermal Plasma," J. Appl. Phys., 85(3):1372-1377.