Optimizing wafer rinsing processes to conserve DI water

MICRO

Volumn 18, Issue 6, 2000, Pages 111-119

  Chiarello, Ron ^a,b,c   Parker, Russ ^d,e,f   Tritapoe, Mike ^b,g,h  

^a STANFORD UNIVERSITY   (United States)

^b UNIVERSITY OF ARIZONA   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

^d AGILENT TECHNOLOGIES   (United States)

^e TRINITY COLLEGE   (United States)

^f PURDUE UNIVERSITY   (United States)

^g ADVANCED MICRO DEVICES   (United States)

^h BRIGHAM YOUNG UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001496371     PISSN: 10810595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. S Bhat, B van Eck, and V Menon, "Cost Models for Gas and Vapor-Phase Wafer Cleaning," in Proceedings of Microcontamination 92 (Santa Monica, CA: Canon Communications, 1992), 588-597.
2. R Chiarello et al., "Optimization of Post-Sulfuric Acid/Hydrogen Peroxide Mix Rinsing," in Proceedings of the MRS Symposium 477 (Warrendale, PA: Materials Research Society, 1997), 533.
3. R Hall et al., "Improving Rinse Efficiency with Automated Cleaning Tools," Semiconductor International 19, no. 12 (1996): 151-160.
4. J Rosato et al., Proceedings of the Electrochemical Society 94-7 (1994), 140-152.
5. SN Kempka, "Evaluation of Overflow Wet Rinsing Efficiency," in Proceedings of Microcontamination 94 (Santa Monica, CA: Canon Communications, 1994), 225-234.
6. R Parker, R Chiarello, and D Gomez, "Extreme Rinse Optimization," in Proceedings of the Semiconductor Pure Water and Chemicals Conference (Sunnyvale, CA: SPWCC, 1998), 323-341.