Finite-element modeling of stress distribution and migration in interconnecting studs of a three-dimensional multilevel device structure

Applied Physics Letters

Volumn 65, Issue 12, 1994, Pages 1516-1518

  Shi, L T ^a   Tu, K N ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

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[No Author keywords available]

Indexed keywords

EID: 0001486246     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.112029     Document Type: Article

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