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Volumn 72, Issue 9, 1992, Pages 4099-4103

Interdiffusions in Cu/reactive-ion-sputtered TiN, Cu/chemical-vapor- deposited TiN, Cu/TaN, and TaN/Cu/TaN thin-film structures: Low temperature diffusion analyses

(4) Olowolafe, J O a Mogab, C J a Gregory, R B b Kottke, M b

a MOTOROLA INC (United States)

b MOTOROLA INC (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001394551 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.352242 Document Type: Article

Times cited : (108)

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