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Journal of Applied Physics
Volumn 71, Issue 12, 1992, Pages 5877-5887
Roles of Ti-intermetallic compound layers on the electromigration resistance of Al-Cu interconnecting stripes
(3)
Lee, C C
a
MacHlin, E S
b
Rathore, H
c
a
MOTOROLA INC
(
United States
)
b
Och Spine at New York Presbyterian Hospitals
(
United States
)
c
IBM
(
United States
)
Author keywords
[No Author keywords available]
Indexed keywords
EID
:
0001170706
PISSN
:
00218979
EISSN
:
None
Source Type
:
Journal
DOI
:
10.1063/1.350485
Document Type
:
Article
Times cited : (
18
)
References (
15
)
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(unpublished)
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(1989)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.
