Pulsed electrothermal technique for measuring the thermal diffusivity of dielectric films on conducting substrates

Journal of Applied Physics

Volumn 80, Issue 11, 1996, Pages 6124-6128

  Bauer, Siegfried ^a,b   De Reggi, Aimé S ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^b UNIVERSITY OF POTSDAM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001124457     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.363687     Document Type: Article

References (19)

1. S. Bauer and B. Ploss, J. Appl. Phys. 68, 6361 (1990).
2. M. B. J. Diemeer, J. J. Brons, and E. S. Trommel, IEEE J. Lightwave Technol. LT7, 449 (1989).
3. F. E. Andros and B. G. Sammakia, in Principles of Electronic Packaging, edited by D. P. Seraphim, R. C. Lasky, and C. Y. Li (McGraw-Hill, New York, 1989), Chap. V.
4. W. J. Parker, R. J. Jenkins, C. P. Butler, and G. L. Abbott, J. Appl. Phys. 32, 1679 (1961).
5. R. E. Collins, J. Appl. Phys. 47, 4804 (1976).
6. S. B. Lang, Ferroelectrics, 11, 3125 (1976).
7. C. E. Yeack, R. L. Melcher, and S. S. Jha, J. Appl. Phys 53, 3947 (1982).
8. R. Zhenobi, J. H. Hahn, and R. N. Zare, Chem. Phys. Lett. 150, 361 (1988).
9. N. Tsutsumi and T. Kiyotsukuri, Appl. Phys. Lett. 52, 442 (1988).
10. A. S. De Reggi, C. M. Guttman, F. I. Mopsik, G. T. Davis, and M. G. Broadhurst, Phys. Rev. Lett. 40, 413 (1978).
11. S. Bauer and A. S. DeReggi, in Proceedings of the 8th International Symposium on Electrets, 1994, pp. 218-223 (IEEE Pub. No. 94 CH3443-9).
12. A. S. DeReggi, M. G. Broadhurst, G. T. Davis, and F. I. Mopsik, in 1987 Annual Report, IEEE Conference on Electrical Insulators and Dielectric Phenomena, 1987, p. 307.
13. B. L. Booth, in Polymers for Lightwave and Integrated Optics, edited by L. A. Homak (Marcel Dekker, New York, 1992), pp. 231-266.
14. D. M. Burland, R. D. Miller, and C. A. Walsh, Chem. Rev. 94, 31 (1994).
15. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids (Clarendon, Oxford, 1947), p. 86.
16. Commercial materials and instrumentation, trade names, and manufacturers names are given here in order to accurately specify or otherwise describe experimental samples used and measurements made. In no way does such disclosure imply endorsement by NIST.
17. M. T. Pottiger and J. C. Coburn, ACS Symp. Ser. 537 (Polymers for Microelectronics) 537, 282 (1994).
18. Du Pont Bulletin PC-21 (Pyralin Polyimide Coatings).
19. J. A. Rogers and K. A. Nelson, Mater. Res. Soc. Symp. Proc. 324, 317 (1994); we thank the authors for providing data on in-plane D of PI-2611 prior to publication.