An optimum spacing problem for three chips mounted on a vertical substrate in an enclosure

Numerical Heat Transfer; Part A: Applications

Volumn 37, Issue 6, 2000, Pages 613-630

  Phan Thien, Nhan ^b  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b UNIVERSITY OF SYDNEY   (Australia)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001086794     PISSN: 10407782     EISSN: 15210634     Source Type: Journal    
DOI: 10.1080/104077800274118     Document Type: Article

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