Creep Behavior and Modeling of SiC-Based PC Ceramic Matrix Composites with Glass Sealant in High Temperature Air

Key Engineering Materials

Volumn 164-165, Issue , 1999, Pages 197-200

  Ishikawa, T ^a   Suzuki, N ^b   Davies, I J ^c   Shibuya, M ^d   Hirokawa, T ^e   Gotoh, J ^f  

^a JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

^b KOGAKUIN UNIVERSITY   (Japan)

^c SOPHIA UNIVERSITY   (Japan)

^d UBE INDUSTRIES LTD   (Japan)

^e Shikibo Ltd   (Japan)

^f KAWASAKI HEAVY INDUSTRIES LTD   (Japan)

Author keywords

3 D Woven; Creep Rupture; Experiments; Fiber Interface Treatment; Glassy Sealant; Polymer Conversion Matrix; Tensile Strength

Indexed keywords

EID: 0001043616     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: None     Document Type: Article

References (5)

1. th Int. Symp. on Space Tech. and Sci., ISTS, Gifu, Japan, 1996.5 , pp.210-215.
2. J. Gotoh, et al.: Proc. of 1997 Annual Meeting of Japan Society of Ceramics, 1997.4.
3. E.J. Lang & T.W. Chou: Proc. of ICCM-11, Vol.5, Gold Coast, Australia, 1997.7, pp. 1-8.
4. Du Pont - Lanxide Corporation Ltd.: Private Technical Information.
5. J.A. Dicarlo et al.: Proceedings of ICCM-10, Vol. VI, Whistler, Canada, 1995.8, pp.315-322.