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Volumn 98, Issue 1, 2000, Pages 270-288

Nickel plating

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0000937196     PISSN: 00260576     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-0576(00)80334-7     Document Type: Article
Times cited : (13)

References (2)
  • 1
    • 0042061686 scopus 로고
    • Nickel
    • Lowenheim, F.A. (Ed.), John Wiley, New York
    • Brown, H. and B.B. Knapp, "Nickel," in Lowenheim, F.A. (Ed.), Modern Electroplating, 3rd Ed., pp. 287-341; John Wiley, New York; 1974
    • (1974) Modern Electroplating, 3rd Ed. , pp. 287-341
    • Brown, H.1    Knapp, B.B.2
  • 2
    • 24044435285 scopus 로고
    • Standard Practice for Use of Copper and Nickel Electroplating Solutions for Electroforming
    • Section 2, Vol. 02.05, B 503-69; ASTM, Philadelphia
    • American Society for Testing and Materials, "Standard Practice for Use of Copper and Nickel Electroplating Solutions for Electroforming," in Annual Book of ASTM Standards, Section 2, Vol. 02.05, B 503-69; ASTM, Philadelphia; 1993
    • (1993) Annual Book of ASTM Standards


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.