Tantalum-based diffusion barriers in Si/Cu VLSI metallizations

Journal of Applied Physics

Volumn 70, Issue 3, 1991, Pages 1369-1373

  Kolawa, E ^a   Chen, J S ^a   Reid, J S ^a   Pokela, P J ^a   Nicolet, M A ^a  

^a CALIFORNIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000899113     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.349594     Document Type: Article

References (19)