Investigation of kinetics model of dc reactive sputtering

Science in China, Series E: Technological Sciences

Volumn 39, Issue 4, 1996, Pages

  Zhu, Shenglong ^a   Wang, Fuhui ^a   Wu, Weitao ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Kinetics model; Physical sputtering model; Reactive sputtering

Indexed keywords

EID: 0000875679     PISSN: 10069321     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (5)

1. Zhu Shenglong, Wang Fuhui, Lou Hanyi et al., Reactive sputter deposition of alumina films on superalloys and their high-temperature corrosion resistance, Surf. Coat. Technol., 1995, 71:9.
2. Heller, Reactive sputtering of metals in oxidizing atmospheres, Thin Solid Films, 1963, 17: 163.
3. Luthji, D. H., Influence of the target material on etching processes using sputtering, Thin Solid Films, 1975, 27: 155.
4. Itoh, S. A., Mechanism of rf reactive sputtering, J. Appl. Phys., 1975, 46: 3381.
5. Penfold, J. A. Thornton, Thin Film Processes (eds. Vossen, J. L., Kern, W.), New York: Academic Press, Inc., 1978, 86-87.