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Volumn 1, Issue 1, 1994, Pages 30-41

Process technology for the modular integration of CMOS and polysilicon microstructures

Author keywords

[No Author keywords available]

Indexed keywords


EID: 0000832581     PISSN: 09467076     EISSN: 14321858     Source Type: Journal    
DOI: 10.1007/BF01367758     Document Type: Article
Times cited : (55)

References (23)
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    • Fedder, G.K.; Chang, J.C.; Howe., R.T. (1992) Thermal assembly of polysilicon microactuators with narrow-gap electrostatic comb drive. Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, 63–68
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    • Fabrication of micromechanical devices from polysilicon films with smooth surfaces
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    • Lin, L.; McNair, K.M.; Howe, R.T.; Pisano, A.P. (1993) Vacuum-encapsulated lateral microresonators. 7th Int'l Conf. on Solid-State Sensors and Actuators-Transducers '93, Yokohama, Japan, 270–273
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.