The influence of steps on the deposition of Cu onto Au(111)

Electrochimica Acta

Volumn 40, Issue 10, 1995, Pages 1237-1247

  Holzle M H ^a   Zwing, V ^a   Kolb, D M ^a  

^a UNIVERSITY OF ULM   (Germany)

Author keywords

copper; metal deposition; nucleation; stepped surfaces; underpotential deposition

Indexed keywords

EID: 0000826726     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/0013-4686(95)00055-J     Document Type: Article

References (42)

1. Trends in Interfacial Electrochemistry
2. Electrochemical Surface Science
3. Metal ion adsorption and electrocrystallization
4. Underpotential deposition of lead on gold single crystal faces
5. Effect of terraces and steps in the electrocatalysis for formic acid oxidation on platinum
6. Kinetic investigations of structural changes and desorption of metal adsorption layers on single crystal planes
7. The influence of adsorbing substances on the UPD of lead onto the (111)-oriented silver single crystal surface—II
8. The kinetics of structural changes in Cu adlayers on Au(111)
9. The influence of anions on the structure of underpotentially deposited Cu on Au(111): A LEED, RHEED and AES study
10. Atomic structure of ordered copper adlayers on single-crystalline gold electrodes
11. Two-dimensional phase transitions in electrochemically formed adlayers on gold
12. STM studies of real and quasi-perfect silver single crystal surfaces used in electrochemical experiments
13. Electrochemical nucleation and growth of copper on polycrystalline palladium